Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste

Hui Fang, Chenxi Wang, Shicheng Zhou, Qiushi Kang, Te Wang, Dong‐Sheng Yang, Yanhong Tian, Tadatomo Suga

2020Journal of Materials Science Materials in Electronics25 citationsDOI

Topics & Concepts

Materials scienceSinteringHydroxideThermal conductivityComposite materialShear strength (soil)Plasma activationOxideVoid (composites)MetallurgyChemical engineeringPlasmaEngineeringPhysicsEnvironmental scienceSoil scienceSoil waterQuantum mechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesInjection Molding Process and Properties