Enhanced thermal conductivity and reduced thermal resistance in carbon fiber-based thermal interface materials with vertically aligned structure
Zhenbang Zhang, Rongjie Yang, Yandong Wang, Kang Xu, Wen Dai, Jianxiang Zhang, Maohua Li, Linhong Li, Yingying Guo, Yue Qin, Boda Zhu, Yiwei Zhou, Xingye Wang, Tao Cai, Cheng‐Te Lin, Kazuhito Nishimura, Hao Nan Li, Nan Jiang, Jinhong Yu
Abstract
A sandwich-structured thermal interface material featuring vertically aligned carbon fibers and liquid metal-modified layers for enhanced thermal conductivity and reduced contact resistance in electronic devices.
Topics & Concepts
Materials scienceThermal conductivityComposite materialThermal resistanceThermalThermal greaseThermal contact conductanceInterfacial thermal resistanceInterface (matter)Contact resistanceMetalThermal contactLayer (electronics)Contact angleMetallurgyMeteorologyPhysicsSessile drop techniqueThermal properties of materialsHeat Transfer and OptimizationAdhesion, Friction, and Surface Interactions