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Simulation Study on Removal Mechanism of Si3N4 Ceramic in Rotary Ultrasonic Grinding

Shiliang Wei, Tao Zhang, Hengju Wei, Wei Wang, Haiyang Wang, Youdi Liu

2023International Journal of Precision Engineering and Manufacturing16 citationsDOI

Topics & Concepts

AbrasiveGrindingCeramicMaterials scienceUltrasonic sensorComposite materialUltrasonic testingMetallurgyAcousticsPhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques
Simulation Study on Removal Mechanism of Si3N4 Ceramic in Rotary Ultrasonic Grinding | Litcius