Spatially selective adhesion enabled transfer printing of liquid metal for 3D electronic circuits
Rui Guo, Yang Zhen, Xian Huang, Jing Liu
Topics & Concepts
ElectronicsElectronic circuitMaterials scienceLiquid metal3D printingTransfer printingStiffnessElectronic componentNanotechnologyMechanical engineeringElectrical engineeringComposite materialEngineeringAdvanced Sensor and Energy Harvesting MaterialsAdvanced Materials and MechanicsNanomaterials and Printing Technologies