Room-temperature bonding of glass chips <i>via</i> PTFE-assisted plasma modification for nanofluidic applications
Qiushi Kang, Chenxi Wang, Kaimeng Liu, Takehiko Kitamori
Abstract
plasma sputtering and constructed fluorinated silicon oxides on the glass surfaces effectively, eliminating the significant etching effect of HF to protect fine nanostructures. Very strong bonding was obtained at RT with no heating and the high-pressure resistant glass-glass interfaces were evaluated under high-pressure-driven flow conditions up to 2 MPa based on a two-channel liquid introduction system. Moreover, the favorable optical transmittance of the fluorinated bonding interface demonstrated a capacity for high-resolution optical detection or liquid sensing.
Topics & Concepts
Anodic bondingSurface modificationMaterials scienceNanotechnologyNanofluidicsSiliconEtching (microfabrication)Composite materialChemical engineeringLayer (electronics)OptoelectronicsEngineeringMicrofluidic and Capillary Electrophoresis ApplicationsNanofabrication and Lithography TechniquesElectrowetting and Microfluidic Technologies