Low-temperature bonding of Cu on Si3N4 substrate by using Ti/Cu thin films
Yanyu Song, Ling Liu, Duo Liu, Xiaoguo Song, Jian Cao
Topics & Concepts
Materials scienceBrazingDiffusion bondingThin filmCeramicNanocrystalline materialSubstrate (aquarium)Composite materialResidual stressMetallurgyNanotechnologyAlloyOceanographyGeologyAdvanced ceramic materials synthesis3D IC and TSV technologiesAdvanced materials and composites