Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)
Hanwen Hu, Kuan‐Neng Chen
Topics & Concepts
Thermocompression bondingAnodic bondingInterconnectionSolderingThree-dimensional integrated circuitCompatibility (geochemistry)Materials scienceCoplanarityStackingWire bondingDirect bondingIntegrated circuitWaferHeat sinkBonding strengthCopperWafer bondingPrinted circuit boardFabricationThermalMechanical engineeringComposite materialChipOptoelectronicsElectrical engineeringMetallurgyComputer scienceEngineeringPathologyMathematicsComputer networkPhysicsMeteorologyAlternative medicineNuclear magnetic resonanceLayer (electronics)GeometryMedicine3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies