Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging
Jiaqi Song, Donglin Zhang, Xin Chen, Shizun Hu, Xiuchen Zhao, Chin C. Lee, Yongjun Huo
Topics & Concepts
Materials scienceIndiumTransient (computer programming)Ultrasonic sensorLiquid phaseComposite materialPhase (matter)Phase changeOptoelectronicsMetallurgyEngineering physicsAcousticsThermodynamicsOrganic chemistryEngineeringOperating systemPhysicsChemistryComputer scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability