Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions
T.T. Dele‐Afolabi, M.A. Azmah Hanim, R. Calin, R.A. Ilyas
Topics & Concepts
Materials scienceSolderingMicrostructureComposite numberComposite materialIntermetallicIsothermal processMetallurgyAlloyPhysicsThermodynamicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties