Litcius/Paper detail

Multi slip activation enabled excellent low-temperature strength-ductility synergy in Al–Cu–Li alloy

Cheng Wang, Jin Zhang, Chunnan Zhu, Youping Yi

2022Vacuum25 citationsDOI

Topics & Concepts

AlloyMaterials scienceDuctility (Earth science)Slip (aerodynamics)Composite materialMetallurgyCreepThermodynamicsPhysicsAluminum Alloy Microstructure PropertiesMicrostructure and mechanical propertiesAluminum Alloys Composites Properties
Multi slip activation enabled excellent low-temperature strength-ductility synergy in Al–Cu–Li alloy | Litcius