Design, Preparation, and Performance Study of a Miniaturized High-Temperature Thick-Film Heat Flux Sensor
Hao Xie, Lei Zhang, Xiao‐Fen Li, Shuolin Li, Zhuya Hao, Hao Wang, Jijun Xiong, Qiulin Tan
Abstract
Solving heat transfer problems in high-temperature and temperature-changing environments is critical in a variety of applications, including modern turbines, aerospace, and nuclear power plants. However, most current thin-film-type heat flow sensors operate at approximately 1000 °C. Thus, we fabricated a kind of platinum–platinum/rhodium thick-film thermopile-type heat flux sensor which can work stably at 1200 °C based on an alumina ceramic substrate. The entire electrode layer was prepared by screen printing process. The surface morphology of the Pt electrode and the material in thermal resistance layer at different stages were investigated using scanning electron microscopy. The steady-state characteristics of the sensor were evaluated by using a high-temperature test platform. The experiments show that the peak voltage of the sensor is 1.4126 mV at the temperature of 1200 °C and the heat flow density of 283.3 kW/m <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . Moreover, the repeatability of sensor at 1200 °C and high temperature holding for 4 h experiments were performed, verifying that the sensor has good consistency and durability. Therefore, we infer that the designed sensor can be applied for a long time under high temperature and large heat flow conditions, such as aerospace, mechanical metallurgy and energy construction fields.