Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure
Wenjie Wang, Zubin Chen, Shaobin Wang, Xu Long
Topics & Concepts
Temperature cyclingMaterials scienceCreepStructural engineeringFinite element methodBendingPlasticityThermalMechanicsComposite materialEngineeringThermodynamicsPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties