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A novel spiral grooved cooling path heat sink for the cooling of high voltage direct current devices

Ehtesham Ali, Sajan Tamang, Jaehyun Park, Jaemun Choi, Jae-Hun Choi, Chanwoo Park, Heesung Park, Chanwoo Park, Heesung Park

2023International Journal of Thermal Sciences11 citationsDOI

Topics & Concepts

Heat sinkMaterials scienceNusselt numberHeat transferMechanicsPassive coolingWater coolingComputer coolingHeat capacity rateMechanical engineeringThermodynamicsHeat spreaderThermal management of electronic devices and systemsPhysicsEngineeringTurbulenceReynolds numberHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies
A novel spiral grooved cooling path heat sink for the cooling of high voltage direct current devices | Litcius