Water-assisted femtosecond laser drilling of 4H-SiC to eliminate cracks and surface material shedding
Wenjun Wang, Hongwei Song, Kai Liao, Xuesong Mei
Topics & Concepts
Materials scienceLaser drillingFemtosecondLaserWaferComposite materialDrillingOptoelectronicsBrittlenessSapphireOpticsMetallurgyPhysicsAdvanced Surface Polishing TechniquesLaser Material Processing TechniquesAdvanced Machining and Optimization Techniques