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A new method of determining the slicing parameters for fixed diamond wire saw

Tengyun Liu, Peiqi Ge, Wenbo Bi, Yufei Gao

2020Materials Science in Semiconductor Processing28 citationsDOI

Topics & Concepts

SlicingDiamondMaterials scienceIngotBrittlenessMachiningWaferComposite materialMechanical engineeringEngineering drawingMetallurgyOptoelectronicsEngineeringAlloyAdvanced Surface Polishing TechniquesTunneling and Rock MechanicsAdvanced machining processes and optimization
A new method of determining the slicing parameters for fixed diamond wire saw | Litcius