Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking
Ye Tian, Heng Fang, Ning Ren, Yatao Zhao, Boli Chen, Fengshun Wu, Kyung‐Wook Paik
Topics & Concepts
Materials scienceSolderingIntermetallicStackingMelting pointJoint (building)InterconnectionFlip chipComposite materialPhase (matter)Temperature cyclingSiliconThermalOptoelectronicsStructural engineeringLayer (electronics)Computer scienceThermodynamicsChemistryEngineeringPhysicsAdhesiveOrganic chemistryAlloyComputer networkElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis