Improved sinterability of micro-scale copper paste with a reducing agent
Soon-Yong Kwon, Tae‐Ik Lee, Hoo-Jeong Lee, Sehoon Yoo
Topics & Concepts
Materials scienceAdipic acidCopperPEG ratioSuccinic acidGlutaric acidReducing agentEthylene glycolDicarboxylic acidPolyethylene glycolEthylene diamineComposite materialMetallurgyChemical engineeringNuclear chemistryPolymer chemistryOrganic chemistryChemistryEngineeringFinanceEconomicsElectronic Packaging and Soldering TechnologiesAdvanced materials and compositesInjection Molding Process and Properties