Application of metal interconnection process with micro-LED display by laser-assisted bonding technology

Wenya Tian, Zehao Ma, Binh Xuan Cao, Jia‐Hua Lin, Yongxin Cui, Xuexuan Huang

2023Journal of Materials Science Materials in Electronics20 citationsDOI

Topics & Concepts

Materials scienceInterconnectionWire bondingBackplaneOptoelectronicsSolderingMetallurgyChipComputer scienceTelecommunicationsComputer networkComputer hardwareElectronic Packaging and Soldering Technologies3D IC and TSV technologiesSemiconductor Lasers and Optical Devices