Technologies for Forming Electrodynamic Structures for Millimeter-Wave and Terahertz Vacuum Microelectronic Devices (Review)
A. V. Starodubov, D. A. Nozhkin, Ilya Rasulov, Alexey A. Serdobintsev, Ilya O. Kozhevnikov, Viktor V. Galushka, V. K. Sakharov, Д. А. Бессонов, Alexander Galkin, И. Ш. Бахтеев, S. Yu. Molchanov, Sergey V. German, Nikita M. Ryskin
Abstract
The electrodynamic microstructure technologies for production of millimeter and submillimeter-wave vacuum microelectronic devices are reviewed, including photolithography, deep reactive ion etching, computer numerical control micro- and nanomilling, electro-erosive micromachining, and additive technologies: 3D printing, selective laser sintering, and selective laser melting. An original approach to manufacture of planar slow-wave systems based on magnetron sputtering and laser ablation is discussed. Technological tolerances and surface roughness that can be obtained using the considered technologies are compared.