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Interfacial transfer and phase evolution between Cu and Sn solder doped with minor Cu, Ag and Ni: experimental and theoretical investigations

Mingyuan Yang, Jieshi Chen, Jin Yang, Peilei Zhang, Zhishui Yu, Zhi Zeng, Hao Lü

2020Applied Physics A31 citationsDOI

Topics & Concepts

IntermetallicMaterials scienceSolderingAlloyCopperPhase (matter)DopingMetallurgyGrain growthGrain sizeMorphology (biology)ChemistryOptoelectronicsGeneticsOrganic chemistryBiologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties
Interfacial transfer and phase evolution between Cu and Sn solder doped with minor Cu, Ag and Ni: experimental and theoretical investigations | Litcius