Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints
Haozhong Wang, Xiaowu Hu, Xiongxin Jiang
Topics & Concepts
Materials scienceSolderingComposite materialComposite numberShear strength (soil)Carbon nanotubeSolder pasteNanoindentationMetallurgySoil scienceSoil waterEnvironmental scienceElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies