Effect of Ag nanoparticles on microstructure evolution, hardness, and bismuth segregation of SnBi/Cu joint
Linmei Yang, Shiran Ma, Guowan Mu, Te Yen Huang
Topics & Concepts
IntermetallicSolderingMaterials scienceBismuthNanoparticleMicrostructureLayer (electronics)DiffusionJoint (building)MetallurgyComposite numberChemical engineeringComposite materialNanotechnologyThermodynamicsEngineeringAlloyArchitectural engineeringPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties