Investigation of the material removal mechanism during ultrasonic-assisted grinding of C/SiC composites
Hailing Zhou, Kai Ding, Jingfei Yin, Yucan Fu, Qilin Li, Bin He, Jinjin Han, Linglei Kong
Topics & Concepts
Materials scienceComposite materialAbrasiveGrindingMachiningFinite element methodFracture (geology)FiberSilicon carbideBrittlenessBendingVibrationAnisotropyDeformation (meteorology)Contact areaPhase (matter)Shear (geology)Fracture mechanicsTribologyNormal forceLayer (electronics)Transverse planeSurface integrityDelamination (geology)Acoustic emissionMicrostructureParticle (ecology)Surface grindingUltrasonic sensorResidual stressFlexural strengthContact forceAdvanced ceramic materials synthesisAdvanced Surface Polishing TechniquesAdvanced materials and composites