Cu@Ag nanoparticles doped micron-sized Ag plates for conductive adhesive with enhanced conductivity
Jingguo Zhang, Minghui Liang, Qiang Hu, Fei Ma, Zhanrong Li, Yonghui Wang, Limin Wang, Shaoming Zhang
Topics & Concepts
Materials scienceElectrical conductorAdhesiveComposite materialNanoparticleDopingConductivityUltimate tensile strengthElectrical resistivity and conductivityConductive polymerNanotechnologyPolymerOptoelectronicsElectrical engineeringPhysical chemistryChemistryLayer (electronics)EngineeringElectronic Packaging and Soldering TechnologiesNanomaterials and Printing TechnologiesAdvanced Sensor and Energy Harvesting Materials