Litcius/Paper detail

A miniature atomization-air-cooled heat sink for electronic chips

Song Chen, Wentao Cheng, Zijian Huang, Ruibin Wang, Yiqun Gu, Zhonghua Zhang, Jiantao Wang, Junwu Kan

2023International Journal of Thermal Sciences33 citationsDOI

Topics & Concepts

Heat sinkMaterials scienceThermal management of electronic devices and systemsDissipationElectronicsElectronic componentVoltageThermalNuclear engineeringHeat transferElectronics coolingOptoelectronicsMechanicsMechanical engineeringThermodynamicsElectrical engineeringPhysicsEngineeringHeat Transfer and OptimizationNanomaterials and Printing TechnologiesFluid Dynamics and Heat Transfer
A miniature atomization-air-cooled heat sink for electronic chips | Litcius