The polymer-based thermal interface materials with improved thermal conductivity, compression resilience, and electromagnetic interference shielding performance by introducing uniformly melamine foam
Dong An, Yucheng Chen, Rizheng He, Huitao Yu, Zhijian Sun, Yifan Liu, Yaqing Liu, Qingsong Lian, Wei Feng, Ching‐Ping Wong
Topics & Concepts
Materials scienceThermal conductivityGrapheneComposite materialHeat sinkElectronicsElectromagnetic shieldingElectromagnetic interferenceThermal greaseOptoelectronicsNanotechnologyMechanical engineeringElectrical engineeringEngineeringElectromagnetic wave absorption materialsThermal properties of materialsDielectric materials and actuators