Topology optimization for unifying deposit thickness in electroplating process
Naoko Ishizuka, Takayuki Yamada, Kazuhiro Izui, Shinji Nishiwaki
Topics & Concepts
ElectroplatingCathodeCurrent densityAnodePlating (geology)Realization (probability)Topology (electrical circuits)Topology optimizationMaterials scienceCurrent (fluid)Deposition (geology)Mechanical engineeringFinite element methodComputer scienceComposite materialLayer (electronics)MathematicsEngineeringElectrical engineeringPhysicsStructural engineeringElectrodeStatisticsSedimentGeophysicsBiologyPaleontologyQuantum mechanicsTopology Optimization in EngineeringAnodic Oxide Films and NanostructuresAdvanced Multi-Objective Optimization Algorithms