Hydroquinone oriented growth control to achieve high-quality copper coating at high rate for electronics interconnection
Li Zheng, Chong Wang, Deng’an Cai, Yunzhong Huang, Kegu Adi, Yan Hong, Yuanming Chen, Guoyun Zhou, Silvia Armini, Stefan De Gendt, Shouxu Wang, Wei He
Topics & Concepts
HydroquinoneCopperElectroplatingCoatingMaterials scienceChronoamperometryElectrochemistryChemical engineeringCrystal (programming language)Plating (geology)AdsorptionCopper platingInterconnectionNanotechnologyMetallurgyChemistryOrganic chemistryPhysical chemistryCyclic voltammetryElectrodeLayer (electronics)Computer scienceComputer networkProgramming languageGeophysicsGeologyEngineeringElectrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionCopper Interconnects and Reliability