A DC-5 GHz TSV-Based 3-D Network for Multichiplet Wireless System Reconfiguration
Yanwen Zheng, Guangbao Shan, Lihong Yang, Xiang Fan, Huihua Cao
Abstract
The diversity communication tasks impose strict requirements on the reconfigurable ability and size of next-generation wireless systems. In this work, a 3-D network is proposed to enhance reconfiguration ability and reduce size, weight, loss, and cost of wireless systems. The network comprises a signal routing Chiplet and 3-D heterogeneous interconnections composed of through silicon via (TSV) and redistribution layer (RDL), enabling dynamic reconfiguration of wireless system architectures. A transmission matrix-based design method is given. For frequency-domain reconfiguration performance, an insertion loss can of less than 2.8 dB and an isolation greater than 35 dB are achieved from dc to 5 GHz. For the time-domain reconfiguration performance, as the data rate increases from 1 to 10 Gb/s, the eye diagram shows an opening from 96.83% to 60% of peak-peak amplitude, jitter ranging from 0.1% to 7% unit interval (UI).