Litcius/Paper detail

Effect of the macro- and microthrowing power of the electrolyte on the uniformity of distribution of electroplated copper in through-holes for PCB

А. А. Kosarev, А. А. Kalinkina, С.С. Кругликов, Т. А. Vagramyan, В. Э. Касаткин

2021Journal of Solid State Electrochemistry21 citationsDOI

Topics & Concepts

ElectroplatingCopperElectrolyteMaterials scienceElectrochemistryMacroPower (physics)Distribution (mathematics)MetallurgyComposite materialElectrodeChemistryThermodynamicsPhysicsMathematicsComputer scienceLayer (electronics)Physical chemistryProgramming languageMathematical analysisElectrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionNanoporous metals and alloys
Effect of the macro- and microthrowing power of the electrolyte on the uniformity of distribution of electroplated copper in through-holes for PCB | Litcius