Revealing the strengthening mechanism of Cu–Sn composites joint fabricated via in-situ reaction for power electronic packaging
Qiman Xu, Yudong Cao, Baishan Chen, Jian Zhou, Feng Xue
Topics & Concepts
In situMaterials scienceComposite materialMechanism (biology)Electronic packagingJoint (building)Power (physics)Structural engineeringChemistryEngineeringPhysicsQuantum mechanicsOrganic chemistryElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites Properties