Effect of electric current stressing on mechanical performance of solders and solder joints: A review
Bo Wang, Wangyun Li, Shuye Zhang, Xingmin Li, Kailin Pan
Topics & Concepts
SolderingMaterials scienceCreepCurrent (fluid)MicrostructureReliability (semiconductor)MetallurgyComposite materialEngineeringElectrical engineeringQuantum mechanicsPhysicsPower (physics)Electronic Packaging and Soldering TechnologiesSemiconductor materials and interfacesIntegrated Circuits and Semiconductor Failure Analysis