A 60 GHz PCB Wideband Antenna-in-Package for 5G/6G Applications
Lidong Chi, Zibin Weng, Yihong Qi, James L. Drewniak
Abstract
A low-cost, wideband printed circuit boards (PCBs) manufactured antenna is proposed in this letter for 5G/6G antenna-in-package (AiP) applications with wideband common-mode current (surface-wave) choking characteristics. The antenna is based on a grounded, wideband, high-efficiency electromagnetic structure (WHEMS) and a backing cavity, in which a radiating choke is introduced. By changing the choking condition of a quarter-wave length, widely applied in traditional low-frequency baluns, wideband common-mode current suppression is achieved. The enclosing wall of the backing cavity is realized by a combination of isolated grounded vias and connected grounded vias based on current polarization on the wall. Finally, a 22% impedance bandwidth (60-75 GHz) and a relative gain of 8-10 dBi within the band is achieved.