Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method
Mian Li, Dekui Mu, Shuiquan Huang, Yueqin Wu, Hui Meng, Xipeng Xu, Han Huang
Topics & Concepts
Wafer dicingMaterials scienceDiamondAlloyCarbideComposite materialTungsten carbideMetallurgySilicon carbideLayer (electronics)Advanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchMetal and Thin Film Mechanics