Determining adhesion of critical interfaces in microelectronics – A reverse Finite Element Modelling approach based on nanoindentation
Georg M. Reuther, Jan Albrecht, R. Dudek, Sven Rzepka
Topics & Concepts
MicroelectronicsFinite element methodNanoindentationMaterials scienceRobustness (evolution)Delamination (geology)Thin filmMechanical engineeringMaterial propertiesComposite materialComputer scienceNanotechnologyStructural engineeringEngineeringChemistryTectonicsBiologyGenePaleontologyBiochemistrySubductionMetal and Thin Film MechanicsAdhesion, Friction, and Surface InteractionsElectronic Packaging and Soldering Technologies