Litcius/Paper detail

Investigation on the sawing temperature in ultrasonic vibration assisted diamond wire sawing monocrystalline silicon

Yan Wang, Li-Xing Song, Jian-Guo Liu, Rui Wang, Bocheng Zhao

2021Materials Science in Semiconductor Processing16 citationsDOI

Topics & Concepts

Monocrystalline siliconMaterials scienceDiamondSiliconVibrationRotational speedComposite materialRotation (mathematics)Ultrasonic sensorDiamond toolThermalWire speedSilicon carbideTransient (computer programming)Mechanical engineeringMetallurgyAcousticsDiamond turningEngineeringGeometryComputer scienceMathematicsOperating systemPhysicsMeteorologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationTunneling and Rock Mechanics
Investigation on the sawing temperature in ultrasonic vibration assisted diamond wire sawing monocrystalline silicon | Litcius