Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium
Ancang Yang, Yaoping Lu, Yonghua Duan, Mengnie Li, Shanju Zheng, Mingjun Peng
Topics & Concepts
IntermetallicIndiumSolderingMaterials scienceNucleationCALPHADDiffusionCritical radiusSubstrate (aquarium)DopingMetallurgyThermodynamicsComposite materialOptoelectronicsAlloyPhase (matter)ChemistryPhase diagramOrganic chemistryMathematicsCurvaturePhysicsOceanographyGeometryGeologyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties