ATPlace2.5D: Analytical Thermal-Aware Chiplet Placement Framework for Large-Scale 2.5D-IC
Qipan Wang, Xueqing Li, Tianyu Jia, Yibo Lin, Runsheng Wang, Ru Huang
Abstract
The surge in consumer electronics is catalyzing the evolution of 2.5D integrated circuits (2.5D-IC). As these systems expand in scale and integrate more chiplets, the significance of chiplet design tools, particularly automatic chiplet placement, is increasingly apparent. Yet, previous studies did not sufficiently consider the distinctive features of chiplets, encountering challenges related to low quality of wire-length and poor scalability. Moreover, the pronounced high temperatures in 2.5D-ICs have not been thoroughly addressed, indicating a lack of thermal-aware design exploration. In response, this paper presents ATPlace2.5D, an analytical thermal-aware chiplet placement framework for large-scale 2.5D-ICs. It can deliver solutions that balance wirelength and temperature, residing on the optimal Pareto frontier, in collaboration with an innovative, physics-based compact thermal model. Experimental results show that AT-Place2.5D can handle more than 60 chiplets in minutes, and outperforms TAP-2.5D in both maximum temperature and total wire-length by 5% and 42% in thermal-aware placement, with a 23× acceleration. This advancement holds promise for promoting the maturity and widespread application of 2.5D-ICs.