Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys
Sezen Aksöz, Fadimana Öcal, Pınar Ata Esener, Esra Öztürk, N. Maraşlı
Abstract
In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn–1 wt % Ag–0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb caused a significant improvement in microhardness while decreasing the melting temperature range, thermal conductivity and electrical conductivity. Addition of 0.5, 1, 1.5 wt % Sb to SAC105 alloy system decreased the thermal conductivity by 48% and electrical conductivity by 27%. The addition of Sb at the same rate increased the microhardness by 27%.
Topics & Concepts
MicrostructureIndentation hardnessMaterials scienceMetallurgyAlloySolderingThermal conductivityElectrical resistivity and conductivityAtmospheric temperature rangeMelting temperatureComposite materialElectrical engineeringEngineeringMeteorologyPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis