Effect of cold drawing strain on the microstructure, mechanical properties and electrical conductivity of low-oxygen copper wires
Fei Yang, Liming Dong, Cai Lei, Linfeng Wang, Zonghan Xie, Feng Fang
Topics & Concepts
Materials scienceMicrostructureElectrical resistivity and conductivityCopperVolume fractionGrain sizeComposite materialTexture (cosmology)DislocationRecrystallization (geology)ConductivitySlip (aerodynamics)MetallurgyYield (engineering)ThermodynamicsElectrical engineeringChemistryGeologyImage (mathematics)PhysicsArtificial intelligenceComputer scienceEngineeringPhysical chemistryPaleontologyMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesCopper Interconnects and Reliability