Manipulating the microstructure of Cu from direct current electrodeposition without additives to overcome the strength-ductility trade-off
Ziming Xue, Zengwei Zhu, Xiaofei Zhan, Xiaofei Xu, Chunjian Shen, Anxin Li, Di Zhu
Topics & Concepts
Materials scienceDuctility (Earth science)MicrostructureDislocationUltimate tensile strengthGrain boundaryLamella (surface anatomy)Composite materialDeformation (meteorology)CreepMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesElectrodeposition and Electroless Coatings