Litcius/Paper detail

Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques

Shuai Zhang, Shuai Zhang, Xinyi Jing, Qingyang Qiu, Jieshi Chen, Kyung‐Wook Paik, Peng He, Shuye Zhang, Shuye Zhang

2024Materials Characterization13 citationsDOI

Topics & Concepts

Materials scienceComposite numberSolderingMetallurgyComposite materialElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMetal Forming Simulation Techniques
Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques | Litcius