Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
Maarten Cauwe, Bart Vandevelde, Chinmay Nawghane, Marnix Van De Slyeke, Alexia Coulon, S. Heltzel
Topics & Concepts
InterconnectionStandardizationEngineeringPrinted circuit boardReliability engineeringManufacturing engineeringComputer scienceElectrical engineeringTelecommunicationsOperating systemElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntegrated Circuits and Semiconductor Failure Analysis