Litcius/Paper detail

Stress analysis for a thin film bonded to an orthotropic substrate under thermal loading

Y. Alinia, Seyed Ali Abbaszadeh-Fathabadi, Mehmet Ali Güler

2020Mechanics Research Communications14 citationsDOI

Topics & Concepts

Orthotropic materialMaterials scienceComposite materialIsotropyPlane stressShear stressElasticity (physics)von Mises yield criterionStiffnessStructural engineeringFinite element methodOpticsPhysicsEngineeringNumerical methods in engineeringMetal Forming Simulation TechniquesMechanical Behavior of Composites
Stress analysis for a thin film bonded to an orthotropic substrate under thermal loading | Litcius