High-efficiency cooling via the monolithic integration of copper on electronic devices
Tarek Gebrael, Jiaqi Li, Arielle R. Gamboa, Jingcheng Ma, Joseph Schaadt, Logan Horowitz, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Topics & Concepts
Materials scienceThermal resistanceCopperOptoelectronicsThermal conductivityElectronicsHeat sinkCoatingTransistorConformal coatingCathodic protectionElectrical resistance and conductanceThermalEngineering physicsElectrical engineeringComposite materialMetallurgyVoltageElectrochemistryPhysicsChemistryEngineeringElectrodePhysical chemistryMeteorologyThermal properties of materialsHeat Transfer and OptimizationAdvanced Thermoelectric Materials and Devices