Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical, Thermal and Dielectric Properties of Low-k Polyimide
Wan-Jing Zhao, Yi-Zhang Tong, Peipei Zeng, Yang-Sheng Zhou, Xianwu Cao, Wei Wu
Topics & Concepts
PolyimideMaterials scienceDielectricComposite materialThermalPolymer chemistryThermodynamicsOptoelectronicsPhysicsLayer (electronics)Synthesis and properties of polymersEpoxy Resin Curing ProcessesTribology and Wear Analysis