Litcius/Paper detail

Thickness Dependence of crack initiation and propagation in stacks for piezoelectric microelectromechanical systems

Kathleen Coleman, Raúl Bermejo, Dominique Leguillon, Susan Trolier‐McKinstry

2020Acta Materialia29 citationsDOIOpen Access PDF

Topics & Concepts

Materials scienceComposite materialFracture mechanicsWeibull modulusPiezoelectricityWaferWeibull distributionMicroelectromechanical systemsThin filmBendingStress (linguistics)Fracture (geology)Stack (abstract data type)Flexural strengthOptoelectronicsProgramming languageNanotechnologyStatisticsPhilosophyComputer scienceMathematicsLinguisticsFerroelectric and Piezoelectric MaterialsAcoustic Wave Resonator TechnologiesUltrasonics and Acoustic Wave Propagation
Thickness Dependence of crack initiation and propagation in stacks for piezoelectric microelectromechanical systems | Litcius