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Boiling heat transfer properties of copper surface with different microstructures

Liying Wang, Yonghua Wang, Wen-Nan Cheng, Huadong Yu, Jinkai Xu

2021Materials Chemistry and Physics18 citationsDOI

Topics & Concepts

Heat transferMaterials scienceHeat transfer coefficientGroove (engineering)Heat fluxBoilingSuperheatingNucleate boilingCritical heat fluxComposite materialThermodynamicsMetallurgyPhysicsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationFluid Dynamics and Heat Transfer
Boiling heat transfer properties of copper surface with different microstructures | Litcius