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Fabrication of thin resin-bonded diamond wire and its application to ductile-mode wire sawing of mono-crystalline silicon

Mengran Ge, Peizhi Wang, Wenbo Bi, Peiqi Ge

2021Materials Science in Semiconductor Processing26 citationsDOI

Topics & Concepts

Materials scienceDiamondWaferComposite materialFabricationSlicingSiliconMetallurgyOptoelectronicsMechanical engineeringEngineeringAlternative medicineMedicinePathologyAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications
Fabrication of thin resin-bonded diamond wire and its application to ductile-mode wire sawing of mono-crystalline silicon | Litcius