Litcius/Paper detail

A novel friction stir diffusion bonding process using convex-vortex pin tools

Shude Ji, Q. Wen, Zhengwei Li

2020Journal of Material Science and Technology41 citationsDOI

Topics & Concepts

Materials scienceDiffusion bondingJoint (building)Composite materialDiffusionWeldingVortexShear (geology)Ultimate tensile strengthFracture (geology)Structural engineeringMechanicsEngineeringPhysicsThermodynamicsAdvanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesMetal Forming Simulation Techniques
A novel friction stir diffusion bonding process using convex-vortex pin tools | Litcius